Product Description
Enterprise-level distributed storage server based on ARM microserver architecture. Fully self-developed storage server, each ARM micro server can have up to 2.5Gb/s physical bandwidth, and the entire server can provide up to 80Gb/s uplink physical bandwidth. It is suitable for massive unstructured data storage, which can effectively reduce Capex and Opex in the data center. It can be applied to video surveillance, media asset management, edge computing, archive backup, gene sequencing, and confidential storage.
Features
1. Low power consumption: The power consumption of the whole machine is 20% lower than that of the INTEL architecture; through the company's unique and innovative control mechanism, it can save more than 80% of energy in the fields of warm storage and cold storage.
2. High density: The number of hard drives that can be installed in a unit space has reached the highest density level in the industry, effectively improving the efficiency of the data center.
3. High reliability: A distributed system is composed of multiple independent ARM microservers. The damage of any ARM microserver will not affect the normal operation of other microservers.
4. The whole machine is fully modularized. The processing capacity, bandwidth and HDD quantity of the ARM microserver are perfectly matched on the hard disk tray, which can be assembled on demand and expanded flexibly.
Product specifications
|
System |
|
|
Number of ARM microservers |
12 |
|
ARM microserver model |
Marvell® ARMADA® 88F6820，ARM Cortex-A9，1.6GHz |
|
Number of hard drives |
24 3.5-inch hard drives (12 trays, with two hard drives on each tray) |
|
Memory Capacity |
Each ARM microserver has 2GB of RAM |
|
Memory type |
DDR4 |
|
eMMCCapacity |
8GB per ARM microserver |
|
Bandwidth |
Each ARM CPU module has two channels of 1Gb/s SGMII |
|
Hard disk interface type |
SATA |
|
Supported hard disk capacity |
No requirement on hard disk capacity, 2TB/4TB/6TB/8TB/10TB/12TB etc. |
|
Network |
|
|
Built-in switching module |
2* support hot swap, support 1+1 and 1:1 protection |
|
Uplink data interface |
4*10G SFP+ ports per switch board |
|
Internal network interface |
The switch board is connected to each ARM micro server through 1Gb/s or 2.5Gb/s SGMII |
|
COM Express Type7 Module |
Optionally supports 2 COM Express Type 7 modules, and each switch board supports 1 COM Express module. Each COM Express module is connected to the switch chip through two 10Gb/s interfaces |
|
Out-of-band management (OOB) interface |
1GE (RJ45) |
|
Console |
RJ45 |
|
BMCModule |
|
|
Form |
Independent BMC module to manage the entire chassis (including power supply, fan, ARM CPU module, etc.), and provide RESTful API interface to the outside |
|
Out-of-band management (OOB) interface |
1GE (RJ45) |
|
Console |
RJ45 |
|
Power |
|
|
Power Module |
2*550W CRPS Power，Support 1+1 redundancy |
|
Voltage |
Input voltage：100-240V 47Hz~63Hz；Output voltage：+12V, +12VSB |
|
Fans |
|
|
Fan module |
4*8038（80*80*38mm）Fans |
|
Maximum speed |
10500RPM±10% |
|
Whole machine |
|
|
Chassis size (W×H×D) |
438mm x 88mm x 820mm (W×H×D) |
|
Package (W×H×D) |
680mm x 380mm x 1130mm(W×H×D) |
|
Weight |
24kg（Package Weight ） |
|
Typical power consumption of the whole machine |
<120W (not including hard disk) |
|
Applicable environment |
|
|
Temperature |
0～35oC |
|
Humidity |
0% ~ 95% Non-condensing |
|
Storage humidity |
0% ~ 95% Non-condensing |
